NanoFab

Characterization

Characterization

 

 

(Optical and Profilometry In-Line Metrology, Optical microscopy, FESEM & EDAX Analysis )

Overview of characterization;

Optical: reflectometry (F20, F40), ellipsometry, Zygo white light interference

Profilometry: Dektak, Alpha step

SEM & EDAX analysis

 

Tool Technique Measures Samples Beam size Analysis
F20 Reflectance Film thickness Dielectrics, semiconductors, thin metals Large spot Multilayer Optical models
F40 Reflectance Film thickness Dielectrics, semiconductors, thin metals Small spot, local areas Multilayer Optical models
Woollam Ellipsometer Film thickness Index (n & k) Dielectrics, semiconductors, thin metals Large spot Multilayer Optical models
Zygo White light Interference Optical step height Large area

Optical Clean Room Metrology Tools (Links to operating manuals)

Tool Technique Requires Material      
Dektak (Bruker) Mechanical Stylus Step in films Any material      
Alpha step Mechanical Stylus Step in films        

 

Optical Microscopes: Several optical microscopes are available in the nanofab including some with cameras for photomicrographs and line-width measuring capabilities. Additional microscopes are available outside the clean room (Axiophot Photomicroscope).

 

Field Emission Scanning Electron Microscope (FESEM)

Operating manual and capabilities

Link to tool scheduling

The FESEM is located in ERC131 and includes EDAX elemental analysis capability.

Sample preparation, size limits, coating for non-conducting samples.

Skills

Posted on

February 17, 2015